description the moonstone tm 1w power led light source is a high performance energy efcient device which can handle high thermal and high driving current. the exposed pad design has excellent heat transfer from the package to the motherboard. the low profle package design is suitable for a wide variety of applications especially where height is a constraint. the package is compatible with refow soldering process. this will give more freedom and fexibility to the light source designer. applications ? portable (fash light, bicycle head light) ? reading light ? architectural lighting ? garden lighting ? decorative lighting asmt-mx00 moonstone tm 1 w power led light source data sheet features ? available in red, amber, green, and blue color. ? energy efcient ? exposed pad for excellent heat transfer ? suitable for refow soldering process ? high current operation ? long operation life ? wide viewing angle ? silicone encapsulation ? esd class hbm class 3b (threshold > 8 kv) ? msl 2a for ingan products ? msl 4 for alingap products specifcations ? allngap technology for red and amber ? 2.1v (typ) at 350ma for allngap ? ingan technology for green and blue ? 3.2v (typ) at 350ma for ingan
2 package dimensions device selection guide ( t j = 25c) part number color luminous flux, f v [1,2] (lm) test current (ma) dice technology min. typ. max. asmt-mr00-agh00 red 25.5 35.0 43.0 350 alingap asmt-mr00-ahj00 33.0 40.0 56.0 350 alingap asmt-ma00-agh00 amber 25.5 35.0 43.0 350 alingap asmt-mg00 green 43.0 60.0 73.0 350 ingan ASMT-MB00 blue 11.5 15.0 25.5 350 ingan notes 1. f v is the total luminous fux output as measured with an integrating sphere at 25 ms mono pulse condition. 2. flux tolerance is 10%. metal slug cathode anode 1 2 3 10.00 8.50 3 1 2 8.50 ? 5.2 6 ? 8.0 0 5.08 0.81 2.00 5.25 1.30 10.60 1.27 3.30 heat sink led zener + ? notes: 1. all dimensions are in millimeters. 2. tolerance is 0.1 mm unless otherwise specifed. 3. metal slug is connected to anode for electrically non-isolated option.
3 part numbering system note: 1. please refer to page 8 for selection details. asmt-m x xx ? x x 1 x 2 x 3 x 4 packaging option color r ? red a ? amber g - green b - blue color bin selection maximum flux bin selection minimum flux bin selection dice type n ? ingan a ? allngap silicone type 00 ? non-di used b1 ? di used absolute maximum ratings (t a = 25c) parameter asmt-mx00/ units dc forward current [1] 350 ma peak pulsing current [2] 1000 ma power dissipation for allngap 805 mw power dissipation for ingan 1225 mw led junction temperature for allngap 125 c led junction temperature for ingan 110 c operating ambient temperature range -40 to +100 c storage temperature range -40 to +120 c reverse volttage [3] not recommended notes: 1. dc forward current C derate linearly based on figure 5 for alingap & figure 11 for ingan. 2. pulse condition duty factor = 10%, frequency = 1khz. 3. not recommended for reverse bias operation.
4 optical characteristics at 350 ma (tj = 25c) part number color peak wavelength, f peak (nm) dominant wave - length, f d [1] (nm) viewing angle, 2? [2] () luminous efciency (lm/w) typ typ typ typ asmt-mr00-agh00 red 635 625 120 48 asmt-mr00-ahj00 red 635 625 120 54 asmt-ma00-agh00 amber 598 590 120 48 asmt-mg00 green 519 525 120 54 ASMT-MB00 blue 454 460 120 13 electrical characteristic at 350 ma (t j = 25c) dice type forward voltage v f (volts) at i f = 350ma thermal resistance r j-ms ( c/w) [1] min. typ. max. typ. allngap 1.7 2.1 2.3 12 ingan 2.8 3.2 3.5 10 notes: 1. r j-ms is thermal resistance from led junction to metal slug. figure 1. relative intensity vs. wavelength for alingap figure 2. forward current vs forward voltage for alingap figure 3. relative luminous flux vs. mono pulse current for alingap figure 4. radiation pattern for alingap 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity red amber 0 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 3 5 0 4 0 0 4 5 0 5 0 0 0 0 . 5 1 1 . 5 2 2 . 5 3 f o r w a r d v o l t a g e - v f o r w a r d c u r r e n t - m a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 200 250 300 350 400 450 500 mono pulse current - ma relative luminous flux (v) - lm 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -70 -50 -30 -10 10 30 50 70 90 off-axis angle() relative intensity
5 figure 5. maximum forward current vs. ambient temperature for alingap derated based on t j max = 125c, r ja = 40c/w / 50c/w and 60c/w figure 6. relative lop (normalized at 25c) vs. junction temperature for alingap figure 7. relative intensity vs. wavelength for ingan figure 8. forward current vs. forward voltage for ingan figure 9. relative luminous flux vs mono pulse current for ingan figure 10. radiation pattern for ingan junction temperature - c relative lop (normalized at 25c) 0 0.5 1 1.5 2 -40 -25 -10 5 20 35 50 65 80 95 110 125 red amber 0 50 100 150 200 250 300 350 400 0 10 20 30 40 50 60 70 80 90 t a - ambient temperature - c i f - max forward current - ma r ja = 60c/w r ja = 40c/w = 50c/w r ja 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity green blue 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 0 100 150 200 250 300 350 400 450 500 mono pulse current - ma relative luminous flux (v) - lm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -70 -50 -30 -10 10 30 50 70 90 off-axis angle () relative intensity green blue 0 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 3 5 0 4 0 0 4 5 0 5 0 0 0 0 . 5 1 1 . 5 2 2 . 5 3 3 . 5 4 f o r w a r d v o l t a g e - v f o r w a r d c u r r en t - m a
6 figure 13. recommended refow soldering profle figure 14. recommended soldering land pattern figure 15. temperature vs. relative forward voltage shift figure 16. relative lop vs junction temperature for ingan devices note: for detail information on refow soldering of avago surface mount leds, do refer to avago application note an1060 surface mounting smt led indicator components. figure 11. maximum forward current vs. ambient temperature for ingan derated based on t j max = 110c, r ja = 30c/w, 40c/w and 50c/w figure 12. dominant wavelength vs. forward current C ingan devices 217 c 200 c 150 c 60 - 120 sec. -6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 255 - 260 c 100 sec. max. 10 - 30 sec. time temperature (acc. to j-std-020c) 17.00 0.20 1.00 0.10 3.1 0.10 8.40 0.10 5.08 0.10 10.70 0.10 -300 -250 -200 -150 -100 -50 0 50 100 150 200 250 300 -40 -15 10 35 60 85 temperature - c relative forward voltage shift (mv) 0 10 20 30 40 50 60 70 80 90 100 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 junction temperature (c) relative lop (%) green blue dominant wavelength ? nm 100 450 forward current ? ma 400 510 520 200 150 540 530 250 300 490 350 480 470 460 500 green blue i f ? maximum forward current ? ma 0 0 t a ? ambient temperature ? c 90 300 350 20 10 30 400 40 50 60 200 70 80 150 100 50 250 r ja = 50 c/ w r ja = 40 c/ w r ja = 30 c/ w
7 color bin selection [x 3 ] individual reel will contain parts from one full bin only. option selection details asmt-mxxx C x x 1 x 2 x 3 x 4 x 1 C minimum flux bin selection x 2 C maximum flux bin selection x 3 C color bin selection x 4 C packaging option other colors 0 full distribution z a and b y b and c w c and d v d and e q a, b and c p b, c and d n c, d and e flux bin limit [x 1 x 2 ] bin luminous flux (lm) at i f = 350ma min. max. d 11.5 15.0 e 15.0 19.5 f 19.5 25.5 g 25.5 33.0 h 33.0 43.0 j 43.0 56.0 k 56.0 73.0 tolerance for each bin limits is 10% color bin limits color bin min. max. red full distribution 620.0 635.0 amber a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 blue a 455.0 460.0 b 460.0 465.0 c 465.0 470.0 d 470.0 475.0 green a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm
packing tube - option 0 tape & reel - option 1 tape dimension dim value a0 8.800.10 b0 16.450.10 k0 3.600.10 w 24.00.10 p 16.00.10 qty/reel 250ea unit: mm a a b a o b p sec tion b sec tion a k o w f e bo 2.5 figure 17. tube dimensions figure 18. carrier tape dimensions example asmt-mr00-ahj00 asmt-mr00-axxxx C allngap red, non-difused x 1 = h C minimum flux bin h x 2 = j C maximum flux bin j x 3 = 0 C full distribution x 4 = 0 C tube option packaging option [x 4 ] selection option 0 tube 1 tape & reel 535.00 top view side view 10.95 20.85 37.00 6.3 11.00 6.5 10.3 5.39 8.3
reel dimensions r10.00 60.0o ? 268.00 ? 330.00 1.00 ? 99.50 1.00 2.30 2.30 24.0 +1.00 ?0.00 ? 13.50 0.50 2.50 0.50 r10.50 0.50 120.0o end there shall be a minimum of 160 mm of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 390 mm of empty component pockets sealed with cover tape. start tape & reel - option 1 (cont.) tape dimension figure 19. carrier tape leader and trailer dimensions figure 20. reel dimensions
disclaimer avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct op - eration of a nuclear facility or for use in medical devices or applications. customer is solely re - sponsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. handling precaution the encapsulation material of the product is made of sili - cone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during as - sembly or handling, the unit should be held on the body only. please refer to avago application note an5288 for detail information. moisture sensitivity this product is qualifed as moisture sensitive level 2a for ingan devices and msl 4 for alingap devices per jedec j-std-020. precautions when handling this mois - ture sensitive product is important to ensure the reliabil - ity of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use ? unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to refow the leds per the original msl rating. ? it is not recommended to open the mbb prior to assembly (e.g. for iqc). for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2012 avago technologies. all rights reserved. obsoletes av01-0668en av02-0129en - december 10, 2012 b. control after opening the mbb ? the humidity indicator card (hic) shall be read immediately upon opening of mbb. ? the leds must be kept at <30c/60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours for msl 2a and 72 hours for msl 4. c. control for unfnished reel ? for any unused leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembly boards ? if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their foor life of 672 hours for msl 2a and 72 hours for msl 4. e. baking is required if ? hic 10% indicator is not blue and 5% indicator is pink. - the leds are exposed to condition of >30c/60% rh at any time. ? the leds foor life exceeded 672 hours for msl 2a and 72 hours for msl 4. recommended baking condition: 605oc for 20hrs.
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